LOCTITE NS 5540 is a single component, high strength, product whose low viscosity makes it easily brushable onto flanges or threads. It is suitable for sealing flanges up to 20 MPa (2900 psi).
Dymax Corporation expands its range of encapsulant materials with the introduction of Multi-Cure® 9037-F. The product cures in seconds upon exposure to UV/Visible light and has secondary heat cure for shadow areas caused by high-profile components on printed circuit boards.
Dymax Corporation, a leading manufacturer of rapid light-curing materials and equipment, introduces Low Shrink™ OP-81-LS epoxy that cures in seconds upon exposure to broad-spectrum light for fast, precise optical assembly.
The new LOCTITE® PC 9021 shock-absorbing backing material from Henkel has proven its ability to prolong the service life of gyratory and cone crushers throughout Europe. Now available in the UK, this supremely tough and flexible material minimises downtime and enhances productivity of machinery operating in the harshest of environments.
Protective gels for PCBs have been developed in recent years in response to many of the conditions noted earlier to solve unique problems in PCB reliability. These gels are in most cases based on the same or similar chemistry to traditional conformal coatings including acrylics, urethanes, and UV curable acrylated urethanes. HumiSeal® UV20GEL is a recent innovation from the polymer scientists at HumiSeal.