UV curable conformal coating materials such as HumiSeal UV40 are frequently used in military, aerospace and automotive applications due to superior resistance to chemicals and mechanical stress. These properties make them difficult to remove when rework under the coating is required.
Henkel’s TECHNOMELT® low pressure molding materials are a single-material solution that delivers a simple, streamlined and low-cost alternative to multi-step, multi-material PCB protection methods.
Consisting of a resin and a hardener, a two-component epoxy can be formulated to offer a wide range of mechanical, thermal and electrical properties.
Dow introduced new DOWSIL TC-4040 Dispensable Thermal Pad, a thermal interface material (TIM) that is easy to dispense, resists slumping and provides strong thermal conductivity, a key property in 5G designs with higher heat caused by greater power densities.
Adhesives are a vital component of almost every packaging application. Glue Dots are one of the most trusted adhesives on the market today. Glue Dots were the first double-sided adhesive dots and created a viable alternative to other types of adhesive. Compared to hot-melt glues, liquid glues, and tapes, Glue Dots are cleaner and safer. Every Glue Dots product is easy to use, acid free, non-toxic, and instantly bonding.