Henkel’s TECHNOMELT® low pressure molding materials are a single-material solution that delivers a simple, streamlined and low-cost alternative to multi-step, multi-material PCB protection methods.

Consisting of a resin and a hardener, a two-component epoxy can be formulated to offer a wide range of mechanical, thermal and electrical properties.

Dow introduced new DOWSIL TC-4040 Dispensable Thermal Pad, a thermal interface material (TIM) that is easy to dispense, resists slumping and provides strong thermal conductivity, a key property in 5G designs with higher heat caused by greater power densities.

Adhesives are a vital component of almost every packaging application. Glue Dots are one of the most trusted adhesives on the market today. Glue Dots were the first double-sided adhesive dots and created a viable alternative to other types of adhesive. Compared to hot-melt glues, liquid glues, and tapes, Glue Dots are cleaner and safer. Every Glue Dots product is easy to use, acid free, non-toxic, and instantly bonding.

Bostik HERBERTS™ 700 series product line (LF794/H180 and LF728/H128) designed for retort and metalized film applications at industrial and medical sectors are now entering APAC market.